Note: The following provides a suggested course description,
objectives, and an outline. These may be modified pending discussion with
the Faculty Chairs, proposing faculty, and other curriculum
reviewers.
Course Description: Provide an overview of the
microelectronics failure analysis process, introduce basic concepts for
fault and defect diagnosis and localization, and gives a review of
specific issues, techniques, and tools. Reviews the basics of reliability
theory and examines the reliability performance of devices made with
different types of technologies.
Course Objectives: To provide an overview of the microelectronics failure analysis process and reliability concepts, introduce basic concepts for fault and defect diagnosis and localization, and give reviews of specific issues, techniques, and tools; r elate semiconductor product performance against reliability risks involving metals, dielectrics, and packages; interpret failure rate data; understand why ICs can fail in the field and their symptoms; understand what burn-in can and cannot do for reliability.
Course Outline by Topical Areas:
- Introduction to modern IC reliability; scope of the problem
- Basic applied statistics for reliability analysis and prediction
- IC fabrication overview
- IC electrical testing overview
- Physical failure modes & mechanisms
- Electrical failure modes and models
- Package reliability failure mechanisms
- Radiation and field failures
- Package analysis and de-packaging
- De-processing
- Inspection
- Internal die electrical testing
- Physical/surface analytical techniques
- Reverse engineering
- Burn-in reliability issues
- Failure analysis information management
