NEEM-6461 Electronic Packaging Principles (IC 701)

Note: The following provides a suggested course description, objectives, and an outline. These may be modified pending discussion with the Faculty Chairs, proposing faculty, and other curriculum reviewers.

Course Description: Electronic packaging, which is an interdisciplinary technology encompassing the interconnection of devices and the establishment and control of their operational environment, has become a dominant factor in the evolution of modern systems. This course provides an introduction to the fundamental principles of electronic packaging at all levels: chip, board, subsystem issues and system. It addresses a broad range of key thermal, mechanical, material, electrical, and reliability issues; and develops the analytical tools that can be utilized to determine the basic effects of such problems in given packaging situations.

Course Objectives: To provide an introduction to the basic principles and important problems at various levels of packaging, and to develop sufficient analytical tools to enable the engineer to derive first-order solutions to such problems.

Course Outline by Topical Areas:

System Integration
Functions and Constraints of Packages
Formulation of Design Problems
Hierarchy of Packages
Single Chip and Multi Chip Modules
Wireability
Packaging Materials
Electrical Properties
Package Electrical Performance
Ground and Power Distribution
Signal Integrity
Thermal Management
Heat Flow Fundamentals
Cooling Techniques
Thermally-induced Stresses
Reliability
Mechanical Issues before Reliability