NEEI-6371 Microelectronics Test Engineering (IC 534) 

Note: The following provides a suggested course description, objectives, and an outline. These may be modified pending discussion with the Faculty Chairs, proposing faculty, and other curriculum reviewers.

Course Description: The course emphasizes Test Engineering as practiced by the CMOS manufacturing industry. The major test topics are: (1) Digital ICs testing with emphasis on automatic test equipment (ATE) operation and particularly details of the major test performed, (2) Mixed-signal testing with emphasis on the peculiar problems, how these are addressed, and knowledge of the sampling theory required to understand mixed-signal testing, and (3) the modern Defect-Based Test (DbT) approach. More detailed digital topics include opens/shorts testing, functional and DC & AC parameter testing, test vector development, and trouble shooting. The mixed-signal lectures will include: analog part specifications, AD & DA converter static measurements, sampling theory (with tutorial CDROM), AD & DA converter dynamic parameters, and general mixed-signal test issues. The defect-based test material will include electronic properties of CMOS defects (bridges, opens, and parametric failures), test method electronic properties, statistical analysis in test limit setting, and system-on-chip test planning.

Course Objectives: The emphasis is to teach Integrated Circuit test application with theoretical test topics used to support practice. Students will understand the operation of complex testers, the use of design for test circuitry in that operation.

Course Outline by Topical Areas:

  • Test Economics
  • Defect behavioral electronics and different test methods
  • The Tester: hardware, software, timing and guardbanding, and IC characterization
  • Mixed signal and analog testing
  • Board Testing and its relation to IC design and test procedures
  • Details of IDDQ testing and its use in test, reliability, and failure analysis